The global die attach machine market was valued at $1.1 billion in 2020, and is expected to surpass around $1.8 billion by 2028, growing at a CAGR of 6.1% over forecast period 2021 to 2028.
Die attach machine also known as die bond machine or die mount is installed for the attachment of the silicon chip to the die pad or die cavity or in the semiconductor package process. By attachment technique, its common types include epoxy, soft solder, sintering, eutectic, and others. Die attach machines are employed in various sectors for applications such as RF and MEMS, optoelectronics, logic, memory, CMOS image sensors, LED, and others.
The COVID 19 outbreak has affected the growth of the die attach machine industry owing to the lockdown measure in the countries and delay in manufacturing and production of die attach machine which are utilized for manufacturing die bonding and others. The novel coronavirus has rapidly spread across various countries and regions, causing enormous impact on lives of people and overall community. Originating as a crisis to human health, it now poses significant threat to worldwide trade, economy, and finance. The impact of lockdown, owing to COVID-19 is vague and economic recovery of die attach machine manufacturers is completely based on their cash reserves.
The growth in demand for consumer electronics is expected to fuel the die attach machine market for electric circuit boards, which will in turn drive the demand for die-attach machines. Increase in demand for hybrid circuits in medical equipment, owing to increase in number of patients is propelling the demand for semiconductor chips. Similarly, the increase can be attributed to the expanding need for user-friendly electronic items as well as the developing residential sector, which drives consumer electronics demand internationally. The mass production of electronic products, which includes smartphones, wearables, and white goods, in China and Taiwan, makes use of several devices, such as optoelectronics, MEMS, and MOEMS. Furthermore, Asia-Pacific is expected to witness higher growth rate, owing to increase in spending on the semiconductor industry development in countries such as India and China, which drives the market growth. Thus, surge in construction projects across different regions across the globe is expected to boost the global die attach machine market growth. However, the fluctuation in raw material prices hinders the growth of the market.
Market players can afford a complete lockdown only for a limited period, after which they would have to alter their investment plans. The die attach machine manufacturers had to emphasize on protecting their staff, operations, and supply chain partners to effectively respond to immediate crisis and discover new ways of working after coronavirus cases began to decline. Furthermore, number of COVID-19 cases are expected to reduce in the near term as vaccine for COVID-19 has been introduced in the market. This is further expected to lead to re-initiation of die attach machine companies at their full-scale capacities, which would aid the market to recover by the start of 2022. Furthermore, growth in semiconductor equipment industries across the globe and rise in demand for LED chips are anticipated to drive the market growth during the forecast period.
Asia-Pacific registered high market share in 2020, and is expected to grow significantly with high CAGR during the forecast period. The region's high concentration of IC makers is expected to drive the demand for die bonder equipment in the Asia-Pacific area. ICs are widely used in a variety of industries, including consumer electronics, industrial, telecommunications, data centers, and automotive. For example, ICs are utilized for sensing and processing applications in high-density storage devices such as solid-state drives (SSDs) and vehicles. As a result of the growing number of chip fabrication facilities around the world, the semiconductor industry in Asia is predicted to grow throughout the forecast period.
Key companies profiled in the die attach machine market report include Anza Technology, Inc, ASM Pacific Technology Limited, BE Semiconductor Industries N.V, Dr. Tresky AG, Fasford Technology Co. Limited, Inseto UK Limited, Kulicke and Soffa Industries, Inc., MicroAssembly Technologies Limited, Palomar Technologies, and Shinkawa Limited.
The Die attach machine market research report covers definition, classification, product classification, product application, development trend, product technology, competitive landscape, industrial chain structure, industry overview, national policy and planning analysis of the industry, the latest dynamic analysis, etc., and also includes major. The study includes drivers and restraints of the global market. It covers the impact of these drivers and restraints on the demand during the forecast period. The report also highlights opportunities in the market at the global level.
The report provides size (in terms of volume and value) of Die attach machine market for the base year 2020 and the forecast between 2021 and 2028. Market numbers have been estimated based on form and application. Market size and forecast for each application segment have been provided for the global and regional market.
This report focuses on the global Die attach machine market status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Die attach machine market development in United States, Europe and China.
It is pertinent to consider that in a volatile global economy, we haven’t just conducted Die attach machine market forecasts in terms of CAGR, but also studied the market based on key parameters, including Year-on-Year (Y-o-Y) growth, to comprehend the certainty of the market and to find and present the lucrative opportunities in market.
In terms of production side, this report researches the Die attach machine capacity, production, value, ex-factory price, growth rate, market share for major manufacturers, regions (or countries) and type.
In terms of consumption side, this report focuses on the consumption of Die attach machine by regions (countries) and application.
Buyers of the report will have access to verified market figures, including global market size in terms of revenue and volume. As part of production analysis, the authors of the report have provided reliable estimations and calculations for global revenue and volume by Type segment of the global Die attach machine market. These figures have been provided in terms of both revenue and volume for the period 2017 to 2028. Additionally, the report provides accurate figures for production by region in terms of revenue as well as volume for the same period. The report also includes production capacity statistics for the same period.
With regard to production bases and technologies, the research in this report covers the production time, base distribution, technical parameters, research and development trends, technology sources, and sources of raw materials of major Die attach machine market companies.
Regarding the analysis of the industry chain, the research of this report covers the raw materials and equipment of Die attach machine market upstream, downstream customers, marketing channels, industry development trends and investment strategy recommendations. The more specific analysis also includes the main application areas of market and consumption, major regions and Consumption, major Chinese producers, distributors, raw material suppliers, equipment providers and their contact information, industry chain relationship analysis.
The research in this report also includes product parameters, production process, cost structure, and data information classified by region, technology and application. Finally, the paper model new project SWOT analysis and investment feasibility study of the case model.
Overall, this is an in-depth research report specifically for the Die attach machine industry. The research center uses an objective and fair way to conduct an in-depth analysis of the development trend of the industry, providing support and evidence for customer competition analysis, development planning, and investment decision-making. In the course of operation, the project has received support and assistance from technicians and marketing personnel in various links of the industry chain.
Die attach machine market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies’ focus related to Die attach machine market.
Prominent players in the market are predicted to face tough competition from the new entrants. However, some of the key players are targeting to acquire the startup companies in order to maintain their dominance in the global market. For a detailed analysis of key companies, their strengths, weaknesses, threats, and opportunities are measured in the report by using industry-standard tools such as the SWOT analysis. Regional coverage of key companies is covered in the report to measure their dominance. Key manufacturers of Die attach machine market are focusing on introducing new products to meet the needs of the patrons. The feasibility of new products is also measured by using industry-standard tools.
Key companies are increasing their investments in research and development activities for the discovery of new products. There has also been a rise in the government funding for the introduction of new Die attach machine market. These factors have benefited the growth of the global market for Die attach machine. Going forward, key companies are predicted to benefit from the new product launches and the adoption of technological advancements. Technical advancements have benefited many industries and the global industry is not an exception.
New product launches and the expansion of already existing business are predicted to benefit the key players in maintaining their dominance in the global market for Die attach machine. The global market is segmented on the basis of region, application, en-users and product type. Based on region, the market is divided into North America, Europe, Asia-Pacific, Latin America and Middle East and Africa (MEA).
In this study, the years considered to estimate the market size of Die attach machine are as follows:
History Year: 2017-2020
Base Year: 2020
Forecast Year 2021 to 2028
Reasons to Purchase this Report:
- Market segmentation analysis including qualitative and quantitative research incorporating the impact of economic and policy aspects
- Regional and country level analysis integrating the demand and supply forces that are influencing the growth of the market.
- Market value USD Million and volume Units Million data for each segment and sub-segment
- Competitive landscape involving the market share of major players, along with the new projects and strategies adopted by players in the past five years
- Comprehensive company profiles covering the product offerings, key financial information, recent developments, SWOT analysis, and strategies employed by the major market players